MediaTek Dimensity 1050 was announced as the toned-down version of Dimensity 1100 octa-core processor which was unveiled earlier last year. It is the first chipset from the Taiwan-based chip manufacturer to come with dual mmwave and sub-6GHz 5G connectivity. Let’s dig deeper into the specifications of the newly launched SoC.
MediaTek Dimensity 1050 Specifications
MediaTek Dimensity 1050 is built on a 6nm fabrication process. It is an octa-core chipset with 2 x performance cores of Cortex A78 clocked at 2.5GHz and 6 efficient cores which might be of Cortex A55 cores. The SoC comes paired with an Arm Mali G610 GPU which is the same GPU we have seen on the Dimensity 8100.
The company claimed that the new processor can deliver up to 53 percent faster downlink speeds compared to LTE + mmWave aggregation. The Dimensity 1050 features 3CC carrier aggregation on the sub-6GHz (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum. It comes with the latest It Wi-Fi 6E support and for superfast Wi-Fi connectivity, it offers a 2×2 MIMO antenna.
The Dimensity 1050 includes the support of up to 144Hz fast refresh rate, Dolby Vision and HDR 10+ playback, and support for hardware for accelerated AV1 video. It comes with MediaTek’s HyperEngine 5.0 suite to provide better gaming performance and additional optimization tools. MediaTek has stated that the smartphone powered by this chipset will be seen in between july and September 2022 and for further details, you can visit the company website.