Honor is gearing up to launch its first flip-style foldable smartphone, rumored to be the Honor Magic Flip. Several details about this clamshell folding phone have already surfaced. And now, the launch timeline and design of an Honor Magic Flip has been leaked.
Honor Magic Flip launch timeline and live images
According to new reports, the Honor Magic Flip will be released during the Spring Festival in China. Now a tipster has also corroborated this information on Weibo (a Chinese microblogging website). Let us know that the Chinese Spring Festival will be held between February 10 and 17. Also, the tipster also shared an image, which shows the design of the new Honor Magic Flip.
According to the leaked images, the back of the Magic Flip will include two circular ring modules. The top module will likely house the image sensor, while the bottom module will house the external cover display. So the design looks a lot like the clamshell folding phones of their former parent company Huawei. Based on what has been leaked so far, the Honor Magic Flip will have a 4,500 mAh battery, which consists of a 2,420 mAh + 1,980 mAh dual-cell battery.
Right now, there is no more information available about Honor Magic Flip. But keep in mind that this is still an unconfirmed report, so one should not be sure about their accuracy for now. To know more about the Honor Magic Flip will have to wait for the public certification and more online reports.