Google launched their first chipset, Tensor, with the Pixel series two years ago. Which carries the company’s Artificial Intelligence or AI skills identity. Currently, Google is working on the third-generation Tensor chip, which will be used in the upcoming Pixel 8 series of smartphones. Now comes the news, the upcoming Tensor G3 chip will see major upgrades. Like modern cores, support for latest storage standards, new GPUs, etc. Let’s take a look at the leaked details of the chip.
Google Tensor G3: Configuration and Features
According to a report by Android Authority, the Google Tensor G3 is codenamed Zuma and features a new core layout of 1+4+4, which is different from the previous two generations of Tensor chips. Earlier chipsets had a 2+2+4 core layout. The primary core of Tensor G3 will be Cortex-X3 and it will run at 3.0 GHz. The mid-core will have four Cortex-A715s, each clocked at 2.45GHz, higher than the Tensor G2’s Cortex-A78.
On the other hand, for smaller cores, there will be four Cortex-A510 cores clocked at 2.15 GHz, which is also faster than the previous generation Tensor processor. Due to the use of last year’s cores, the Google Tensor G3 chip is expected to be slightly behind the Qualcomm Snapdragon 8 Gen 3 and the MediaTek Dimension 9300.
The CPU upgrade for the Tensor G3 is expected to improve the overall performance and efficiency of the Google Pixel 8 series smartphones, including ARM V9 support for enhanced security. Google will also remove 32-bit support, which has already been phased out on the Pixel 7. The new chip will also improve the storage capacity of the Pixel 8, which will come with faster and more efficient UFS 4.0 storage like the latest high-end smartphones.
Also, in terms of graphics processing unit, the chip will see Arm’s new Immortalis GPU. Supporting ray-tracing will further increase the acceptance of Google phones among gamers.
Again, the Pixel 8’s Google Tensor G3 chip will have a “BigWave” block for more advanced video decoding and encoding, including AV1 encoding up to 4K30. The chip can support up to 8K30 encoding. A new TPU upgrade, “Rio” boosts the clock speed to 1.1 GHz, and a new DSP, “Callisto” helps with image processing.
Despite all these upgrades, the Pixel 8’s Tensor G3 chip modem will remain the same as the previous model. This mobile platform could be a 4 nanometer chip, which will be manufactured by Samsung The Pixel 8 series is expected to launch in October.